# ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs — retained record

> Retained news record from news:digitimes.

Canonical: https://highsignal.app/data/records/db34a69fe8a60448

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source: [news](https://highsignal.app/data/news) (news:digitimes)  published 2026-09-11 23:05 ingested 2026-09-12 02:56

[original source ↗](https://www.digitimes.com/news/a20260911VL230/inspection-packaging-production-equipment-taiwan.html)

## retained text



```
Wong Ting Lik, vice president and head of ViTrox's Machine Vision System business unit. Credit: DIGITIMES
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
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document fetched 2026-09-12 02:56 · canonical https://digitimes.com/news/a20260911VL230/inspection-packaging-production-equipment-taiwan.html