Intel has signed a memorandum of understanding (MoU) with the Indian government and US-based 3DGS to establish an...

Intel has signed a memorandum of understanding (MoU) with the Indian government and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in Odisha, India. This marks Intel's first major participation in India's semiconductor manufacturing ecosystem beyond design and R&D. The facility will focus on glass-core substrates, a critical technology for advanced packaging of AI and high-performance chips. This move strengthens Intel's foundry and packaging capabilities, diversifying supply chain away from East Asia. The investment aligns with India's push to become a semiconductor packaging hub, as reported by Digitimes (source: https://www.digitimes.com/news/a20260605VL200/india-roundup-packaging-wafer-chip-supply-electronics.html). While a MoU, it signals Intel's commitment to expanding advanced packaging capacity, which is vital for AI infrastructure. Competitors TSMC and Samsung are also investing in advanced packaging, so this creates competitive pressure. The long-term impact on Intel's foundry roadmap and ability to attract AI chip customers is positive.