Hon Hai Precision Industry
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Foxconn (Hon Hai Precision Industry) has signed a strategic pact with Sharp to prioritize AI servers and smart...
Foxconn (Hon Hai Precision Industry) has signed a strategic pact with Sharp to prioritize AI servers and smart infrastructure, according to a Digitimes report on June 25, 2026.
Foxconn has announced a partnership with Bull (Atos) to manufacture NVIDIA's next-generation Vera Rubin NVL72 systems...
Foxconn has announced a partnership with Bull (Atos) to manufacture NVIDIA's next-generation Vera Rubin NVL72 systems in Europe.
Foxconn has announced several strategic partnerships in mid-June 2026, signaling a broad expansion into AI...
Foxconn has announced several strategic partnerships in mid-June 2026, signaling a broad expansion into AI infrastructure, electric vehicles, and renewable energy.
Foxconn (Hon Hai) announced a strategic partnership with Schneider Electric to co-develop next-generation AI data...
Foxconn (Hon Hai) announced a strategic partnership with Schneider Electric to co-develop next-generation AI data center reference architectures, combining Foxconn's AI systems and global manufacturing with Schneider's power, cooling, and energy management expertise (Digitimes;...
Foxconn (Hon Hai Precision Industry) reported record May revenue, with sales growth accelerating beyond analyst...
Foxconn (Hon Hai Precision Industry) reported record May revenue, with sales growth accelerating beyond analyst estimates according to Bloomberg, driven by surging AI server demand.
Foxconn announced a strategic collaboration with Bull to manufacture AI and cloud infrastructure in Europe, with an...
Foxconn announced a strategic collaboration with Bull to manufacture AI and cloud infrastructure in Europe, with an initial investment exceeding EUR 120 million (Digitimes, HPCWire).
On May 29, 2026, Foxconn reported reaching over 40% share in AI servers and is positioning for CPO (co-packaged optics)...
On May 29, 2026, Foxconn reported reaching over 40% share in AI servers and is positioning for CPO (co-packaged optics) leadership (Digitimes).
On May 29, 2026, Foxconn announced plans to break ground on a chip-packaging plant in France, marking a significant...
On May 29, 2026, Foxconn announced plans to break ground on a chip-packaging plant in France, marking a significant expansion into semiconductor infrastructure (Source: Digitimes).