ASML CEO Christophe Fouquet confirmed direct talks with Elon Musk about the TeraFab chipmaking megaproject in Texas,...

ASML CEO Christophe Fouquet confirmed direct talks with Elon Musk about the TeraFab chipmaking megaproject in Texas, with Musk targeting a $119 billion facility that would require billions in ASML equipment (source: Tom's Hardware). Fouquet stated that Elon Musk is 'very serious' about TeraFab, which will combine logic, memory, and advanced packaging. Intel has already joined the project, committing its 14A process technology. The CEO also announced that the first logic chips produced with ASML's High NA EUV lithography systems are expected within months, with Intel being the earliest adopter. This confirms a significant new demand pipeline for ASML's most advanced tools, which are required for leading-edge chip production. Additionally, Fouquet revealed ASML is developing a second advanced packaging tool, expanding beyond lithography. On export controls, he argued against the proposed MATCH Act restrictions, warning they would accelerate China's domestic efforts. This development signals sustained strong demand for ASML's equipment from new entrants and existing customers, reinforcing ASML's monopoly position in EUV lithography and supporting long-term revenue growth.