Cadence and Samsung Foundry announced a multi-year agreement to expand Memory and Interface IP, including NVIDIA...

Cadence and Samsung Foundry announced a multi-year agreement to expand Memory and Interface IP, including NVIDIA NVLink-C2C, and certify Cadence's agentic AI EDA flows on Samsung's second-generation 2nm node. This strengthens Cadence's position in advanced-node design for AI infrastructure and physical AI, directly benefiting its core EDA and IP business. The collaboration also enables Samsung 3D Cube-H with hybrid copper bonding, expanding Cadence's 3D-IC platform. This partnership builds on the 2025 announcement and provides a production-proven platform for joint customers. The official press release was covered by HPCwire (https://www.hpcwire.com/off-the-wire/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration/). Competitor Synopsys may face increased competition for Samsung Foundry designs, while NVIDIA's involvement signals continued demand for Cadence-enabled interconnects.