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Investor-relations pagesKeeps: headline, IR url
- 2026-04-30CANON IR snapshot
Conference on results for 1Q 2026 (April 23, 2026) Before clicking download, please select one of the following statements that best describes you.
CANONir:CANON - 2026-04-30TEL IR snapshot
Investor Relations - IR News - IR Calendar External recognition and awards - [FTSE4Good Tokyo Electron has been a constituent since 2003.](https://www.ftserussell.com/products/indices/ftse4good) - [MSCI Selection Indexes 2025 Tokyo Electron has been a constituent since 2017.](htt
TELir:TEL - 2026-04-30REBELLIONS IR snapshot
Built for Inference Optimized for Real-World AI Deployment Efficient by Design Maximize Performance per Watt Seamless Deployment Easily Integrate Into Existing Environments Scalable Infrastructure From Server to Rack and Beyond Optimized for Real-World AI Deployment Maximize Perf
REBELLIONSir:REBELLIONS - 2026-04-30ACLS IR snapshot
Investor Relations Corporate Profile For over forty five years, Axcelis Technologies has delivered vital equipment, services and process expertise to the semiconductor manufacturing industry, helping customers reach higher levels of productivity with each new technology generatio
ACLSir:ACLS - 2026-04-30NIKON IR snapshot
Investor Relations - Apr. 30, 2026 - Feb. 12, 2026 - Feb. 5, 2026 - Feb. 5, 2026 - Feb. 5, 2026 - Nov. 6, 2025 - Oct. 31, 2025 Topics Message from the CFO A message from Takeshi Matsumoto, CFO, to investors and shareholders. Medium Term Management Plan Presentation Material of Me
NIKONir:NIKON - 2026-04-30KLAC IR snapshot
Latest Financial Results Q3 2026 Quarterly Results Quarter Ended Mar 31, 2026 Quarter Ended Mar 31, 2026 For Fiscal Year Ending Jun 30, 2025 KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced proces
KLACir:KLAC - 2026-04-30LRCX IR snapshot
(Nasdaq: LRCX) Lam Research Corp. Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customers to build smaller and better performing devices. In fact, today, nearl
LRCXir:LRCX - 2026-04-30AMAT IR snapshot
[Show all](#) Q1 2026 [News Release](/static-files/a14b7e94-2685-440a-a78a-c48055b00603)249.7 KB[Non-GAAP Reconciliation](/static-files/b57401e1-8251-4b45-8d62-8203885de500)282.5 KB[Q1 2026 Results Snapshot](/static-files/d9fc274d-c5c9-41e6-92d1-55a210f4a358)193.6 KB Q4 2025 [New
AMATir:AMAT - 2026-04-30ASML IR snapshot
Explore our financial results, share information, and strategy for growth as a leader in the competitive semiconductor industry. [Annual reports](/en/investors/annual-report) ASML files its annual report with the US Securities Exchange Commission each year. Explore the results an
ASMLir:ASML - 2026-04-30RAPIDUS IR snapshot
Technology Development Begins with People; The Growth of Engineers Who Never Give Up—and Gaining Certainty in 2nm Advanced Semiconductor Development As Rapidus races toward 2nm mass production, Shigehiro Fujino describes how frontline engineers overcame challenges to build confid
RAPIDUSir:RAPIDUS - 2026-04-30GFS IR snapshot
Press Releases March 31, 2026 GlobalFoundries Announces Conference Call to Review First Quarter 2026 Financial Results March 26, 2026 GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation March 11, 2026
GFSir:GFS - 2026-04-30HAILO IR snapshot
Our processors are geared towards the new era of generative AI on the edge, in parallel to enabling perception and video enhancement through our wide range of AI accelerators and vision processors. Co-processors that integrate with edge platforms, empowering real-time deep learni
HAILOir:HAILO - 2026-04-30LIGHTMATTER IR snapshot
Interconnects Built for AI Scale Lightmatter’s photonic chips form a complete interconnect platform. Passage™ interconnects and Guide® light engines scale networking for AI supercomputers. Photonic Interconnect Passage Complete photonics roadmap from NPO and OBO to 2D and 3D CPO
LIGHTMATTERir:LIGHTMATTER - 2026-04-30MATX IR snapshot
High-throughput chips for LLMs Our goal is to make the best chips physically possible for the large model needs of frontier labs. The [MatX One](/research/series_b) chip delivers higher throughput than any announced product while also matching the best latencies of any products.
MATXir:MATX - 2026-04-30ETCHED IR snapshot
Building the hardware for superintelligence. Careers Building the hardware for superintelligence.
ETCHEDir:ETCHED - 2026-04-30RAIN IR snapshot
0 Skip to Content About Blog Careers Contact Us Open Menu Close Menu About Blog Careers Contact Us Open Menu Close Menu About Blog Careers Contact Us We’re building the most energy efficient hardware for AI. Learn More Learn More
RAINir:RAIN - 2026-04-30GRAPHCORE IR snapshot
GRAPHCORE OPENS INDIA AI ENGINEERING CENTER Graphcore technology lets innovators create the next breakthroughs in artificial intelligence to enhance human potential. We’re optimistic for a future where people live healthier, fairer, more informed, more sustainable lives. Read the
GRAPHCOREir:GRAPHCORE - 2026-04-30TENSTORRENT IR snapshot
Cards Add to, or config your own rig. Passive, active and liquid cooling options. Starting at $999 Join as we unveil Tenstorrent’s AI solutions deployed at scale. See the full breadth of what we've built — validated by real architecture, benchmarks, and customer deployments. Add
TENSTORRENTir:TENSTORRENT - 2026-04-30SAMBANOVA IR snapshot
Purpose-built for agentic AI inference Our custom dataflow technology and three-tier memory architecture delivers energy efficiency for fast inference and model bundling. [Get Started](/contact) Introducing the SN50 RDU -our fifth-generation AI chip! Only chip to deliver the spee
SAMBANOVAir:SAMBANOVA - 2026-04-30GROQ IR snapshot
Speed at a winning cost Inference is Fuel for AI Born for this. Literally. Groq pioneered the LPU in 2016, the first chip purpose-built for inference. Every design choice focuses on keeping intelligence fast and affordable. Benchmarks don’t ship. Workloads do. Inference works bes
GROQir:GROQ - 2026-04-30TCEHY IR snapshot
欢迎来到Tencent.com! 我们希望使用分析型Cookies和类似技术 (“Cookies”) 来改善我们的网站。 Cookies收集的信息不会识别您个人。有关我们使用的Cookies的类型以及您的偏好选项(包括如何更改您的偏好设置)的更多信息,请查看此处的[Cookies政策](https://www.tencent.com/en-us/cookies-policy.html)。 Creating long-term value for investors with an open and pragmatic approach 2026.05.1
TCEHYir:TCEHY - 2026-04-30BIDU IR snapshot
Investor Overview See All Press releases Baidu to Report First Quarter 2026 Financial Results on May 18, 2026 Apr 23, 2026 Baidu, Inc. Files Its Annual Report on Form 20-F Mar 17, 2026 Baidu Announces Fourth Quarter and Fiscal Year 2025 Results Feb 26, 2026 Presentation Presentat
BIDUir:BIDU - 2026-04-30IBM IR snapshot
Today’s IBM has defined a clear strategy to lead in the era of hybrid cloud and AI 2026 Q1 2025 Q4 2025 Q3 2025 Q2 Current and past financial reports Current and past dividend payments See today's IBM stock performance Use this look-up tool to obtain historical IBM stock prices
IBMir:IBM - 2026-04-30INTC IR snapshot
Latest News [Intel Reports First-Quarter 2026 Financial Results](https://www.intc.com/news-events/press-releases/detail/1767/intel-reports-first-quarter-2026-financial-results) [View All Press Releases](https://www.intc.com/news-events/press-releases) For Fiscal Year Ending Dec 2
INTCir:INTC - 2026-04-30AMD IR snapshot
Investor Relations Latest Financial Results Q4 & FY 2025 Fiscal Year Ended Dec 27, 2025 For complete information regarding our financials, see our periodic [filings](/financial-information/sec-filings) Latest Events [View All Events](/news-events/ir-calendar) May 13, 2026 • 9:00
AMDir:AMD