ASE Technology Holding (ASEH) has indicated that AI-driven demand for advanced packaging is expected to sustain...

ASE Technology Holding (ASEH) has indicated that AI-driven demand for advanced packaging is expected to sustain capacity utilization through 2030. According to a Digitimes report (source), ASE's outlook points to prolonged tightness in packaging capacity, driven by AI chip demand from hyperscalers and GPU vendors. This aligns with ASE's investor relations messaging emphasizing its leadership in advanced packaging for the AI era (source). The long demand horizon supports revenue visibility and potential pricing power for ASEH, while also signaling sustained capex needs across the supply chain. Spillover beneficiaries include TSMC (co-packaging partner), NVIDIA and AMD (major packaging clients), and other AI chip designers like Broadcom and Marvell.