According to a TrendForce report citing industry sources, ASE Technology Holding (ASEH) has raised its packaging quotes...

According to a TrendForce report citing industry sources, ASE Technology Holding (ASEH) has raised its packaging quotes by more than 20%. The increase covers advanced packaging technologies such as CoWoS and FoCoS, driven by higher raw material costs and increasing long-term investment needs. Major U.S. customers are among those affected. ASE COO Tien Wu confirmed the pricing strategy reflects higher raw material costs and growing capital investment, with AI being the key driver behind capacity expansion. ASE is aggressively expanding capacity with around 15 new factory projects underway and has raised capex to $8.5 billion in 2026. This price hike signals strong demand and pricing power, benefiting ASEH's revenue and margins. The move also highlights the tight OSAT capacity market, with TSMC's CoWoS supply constrained. Spillover effects may impact customers like NVDA, AMD, and AAPL, as well as peers AMKR and JCET.