Taiwan's outbound investment hit a record high in early 2026, driven by TSMC and AI supply chains, while China's share...

Taiwan's outbound investment hit a record high in early 2026, driven by TSMC and AI supply chains, while China's share fell to 0.86% (Source 2). This shift underscores TSMC's global expansion, further evidenced by a Taiwanese legislative delegation visiting TSMC's Arizona fab (Source 6). Meanwhile, TSMC's first CoPoS (likely CoWoS) demo tools entered validation, indicating progress in advanced packaging for AI chips (Source 10). A minor setback is the glass substrate rollout delay until after 2030 (Source 9), but this does not overshadow the broader positive momentum in TSMC's international capacity expansion. These developments signal strengthening of TSMC's role in AI infrastructure and reduced reliance on China, benefiting its major customers like Nvidia, AMD, Apple, Broadcom, and Google.